Silicon wafer bonding: key to MEMS high-volume manufacturing

Sensors (Peterborough, NH)

Volumn 15, Issue 12, 1998, Pages

  Mirza, A R ^a   Ayon, A A ^a  

^a Electronic Visions   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANODIC BONDING; DIRECT WAFER BONDING; PRESSURE SENSORS;

BOND STRENGTH (MATERIALS); BONDING; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING GLASS; SILICON SENSORS; SILICON WAFERS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0032294047     PISSN: 07469462     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (17)