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Volumn 16, Issue 2, 2001, Pages 413-416
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Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures
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Author keywords
[No Author keywords available]
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Indexed keywords
ANNEALING;
CRYSTAL MICROSTRUCTURE;
CRYSTAL ORIENTATION;
CRYSTALLOGRAPHY;
CURRENT DENSITY;
DIFFUSION;
ELECTROMIGRATION;
GRAIN BOUNDARIES;
INTERFACES (MATERIALS);
BAMBOO GRAIN STRUCTURES;
CRYSTALLOGRAPHIC ORIENTATION;
BAMBOO;
BAMBOO;
CRYSTAL STRUCTURE;
DIFFUSION;
INTERFACES;
MICROSTRUCTURE;
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EID: 0035262021
PISSN: 08842914
EISSN: None
Source Type: Journal
DOI: 10.1557/JMR.2001.0062 Document Type: Article |
Times cited : (7)
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References (26)
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