Effect of Cu concentration and distribution on the lifetimes of submicron, bamboo Al(Cu) runners

Materials Research Society Symposium - Proceedings

Volumn 473, Issue , 1997, Pages 387-392

  Theiss, Silva K ^a   Prybyla, J A ^a   Marcus, M A ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; COPPER; ELECTROMIGRATION;

POLYGRANULAR LINES;

ELECTRIC WIRING;

EID: 0031359027     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-473-387     Document Type: Conference Paper

References (18)