Integration issues for diamond like carbon in a copper damascene process flow

Materials Research Society Symposium - Proceedings

Volumn 511, Issue , 1998, Pages 223-232

  Grill, A ^a   Jahnes, C ^a   Patel, V ^a   Ott, J ^a   Hummel, J ^a   Mih, R ^a   Liu, J ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; CHEMICAL OPERATIONS; CHEMICAL VAPOR DEPOSITION; COPPER COMPOUNDS; DIELECTRIC MATERIALS; HYDROGENATION; PERMITTIVITY; PERMITTIVITY MEASUREMENT; TEMPERATURE; THERMODYNAMIC STABILITY;

BACK TO END INTERCONNECT DIELECTRIC; COPPER DAMASCENE; DIAMOND LIKE CARBON; PROCESS FLOW;

DIAMOND FILMS;

EID: 0032293099     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-511-223     Document Type: Conference Paper

References (6)