New method for an accurate determination of residual strain in polycrystalline silicon films by analyzing resonant frequencies of micromachined beams

Journal of Micromechanics and Microengineering

Volumn 11, Issue 1, 2001, Pages 55-60

  Ikehara, T ^a   Zwijze, R A F ^b   Ikeda, K ^c  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b UNIVERSITY OF TWENTE   (Netherlands)

^c TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; COMPRESSIVE STRESS; FILMS; FINITE ELEMENT METHOD; MICROMACHINING; NATURAL FREQUENCIES; RESIDUAL STRESSES; STRAIN;

MICROMACHINED BEAMS; RESIDUAL STRAIN;

POLYCRYSTALLINE MATERIALS;

EID: 0035125194     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/11/1/309     Document Type: Article

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