Analytical and finite-element modeling of resonant silicon microsensors

Sensors and Materials

Volumn 9, Issue 8, 1997, Pages 501-519

  Fabula, Thomas ^a,c   Büttgenbach, Stephanus ^b  

^a Hahn Schickard Gesellschaft   (Germany)

^b TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^c DEUTSCHE TELEKOM LABORATORIES   (Germany)

Author keywords

'beam on diaphragm' pressure sensor; Electromechanical coupling factor; Finite element modeling; Modal analysis; Mode coupling; Piezoelectric thin films; Resonant force sensors; Resonant pressure sensors; Stress stiffening; Triple beam force sensor

Indexed keywords

EID: 0342655230     PISSN: 09144935     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (14)

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