Study on wettability and defects behavior of flow-soldered joint using low residue flux

Journal of Electronics Manufacturing

Volumn 8, Issue 3, 1998, Pages 235-241

  Choi, M K ^a   Lee, C Y ^a   Shur, C J ^a   Jung, J P ^b  

^a Sungkyunkwan University   (South Korea)

^b University of Seoul   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; FLUXES; SOLDERED JOINTS;

RESIDUE FLUX;

ELECTRONICS PACKAGING;

EID: 0032284831     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/s0960313198000227     Document Type: Article

References (20)

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