Coating and dicing of wafer applied underfills for low-cost flip chip processing

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2000, Pages 175-179

  Busch, Stephen C ^a   Lu, Jicun ^a   Smith, Brian ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COATING TECHNIQUES; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE;

DICING; UNDERFILLS;

FLIP CHIP DEVICES;

EID: 0033684823     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)