High reliable and mass production-able flip chip package using non conductive film resin

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 415-418

  Usui, Hal ^a   Mizutani, Masaki ^a   Noro, Hiroshi ^a   Kuwamura, Makoto ^a   Ito, Satoshi ^a  

^a Nitto Denko America   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; ELECTRODES; ELECTRONICS PACKAGING; EPOXY RESINS; PRESSURE; PRODUCTIVITY; RELIABILITY; SUBSTRATES; TEMPERATURE;

FLIP CHIP BONDING MACHINES; FLIP CHIP PACKAGE; NONCONDUCTIVE FILM RESIN;

FLIP CHIP DEVICES;

EID: 0032667893     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (3)