Wafer scale packaging based on underfill applied at the wafer level for low-cost flip chip processing

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 827-831

  Johnson, C Dustin ^a   Busch, Stephen C ^a   Baldwin, Daniel F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0346401592     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (2)

1. Mizutani, M.., 1998, "A Study of a New Flip Chip Packaging Process for Diversified Bump and Land Combination," 1998 Electronic Components and Technology Conf, pp. 316-319.
2. Gilleo, K. and Blumel, D., 1996, "The Great Underfill Race," 1998 International Symposium on Microelectronics, pp. 701-706.