Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measurements

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 721-728

  Gurumurthy, C K ^a   Norris, L G ^a   Hui, Chung Yuen ^b   Kramer, E J ^c  

^a Cornell University   (United States)

^b Department of Obstetrics Gynecology   (United States)

^c University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER BEAMS; CRACKS; FATIGUE CRACK PROPAGATION; FATIGUE TESTING; FRACTURE TESTING; GROWTH RATE; NETWORK COMPONENTS; THERMAL FATIGUE; ADHESION; CRACK PROPAGATION; EPOXY RESINS; FATIGUE OF MATERIALS; FRACTURE TOUGHNESS; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); PASSIVATION;

DIRECT CHIP ATTACH; DOUBLE CANTILEVER BEAM; FATIGUE MEASUREMENTS; FIBER OPTIC DISPLACEMENT SENSOR; INTERFACIAL ADHESIONS; PHASE ANGLES; RELIABILITY TESTING; UNDERFILL EPOXY;

FRACTURE TOUGHNESS; ELECTRONICS PACKAGING;

ASYMMETRIC DOUBLE CANTILEVER BEAM (ADCB) TESTING; DIRECT CHIP ATTACH (DCA) ASSEMBLIES;

EID: 0031640724     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678778     Document Type: Conference Paper

References (15)

1. Burkhart, A., Naito, C., Goodrich, B., 1994, 'New Generation Encapsulants for Chips on Low Cost First Level Substrates', Proceedings-NEPCON West 1994, Vol. II, Anaheim, CA, pp. 1503-1511.
2. Calistri Yeh, M., Kramer, E. J., Sharma, R., Zhao, W., Rafailovich, M. H., Sokolov, J., Brock, J. D, 1996, "Thermal Stability of Self-Assembled Monolayers from Alkylchlorosilances", Langmuir, Vol. 12, pp. 2747-2755.
3. Fox, P. G., 1977, "Mechanisms of Environment Sensitive Cracking in Glasses", Mechanisms of Environment Sensitive Cracking of Materials, The Metals Society, London, pp 268-282.
4. Gurumurthy, C. K., 1996. "Warpage in Area Array Microelectronic Devices". M. S. Thesis, State University of NewYork at Binghamton, Binghamton, NY.
5. Gurumurthy, C. K., Jiao, J., Norris, L. G., Hui, C. Y., Kramer, E. J., 1997, "A New Approach For Thermal Fatigue Testing Of The Underfill/Passivation Interface", AMD-Vol. 222/EEP-Vol. 20, Application of Fracture Mechanics in Electronic Packaging, ASME, pp 41-48.
6. Jiao, J., Gurumurthy, C. K., Kramer, E. J., Sha, Y., Hui, C. Y., Borgesen, P., 1997, "Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen", AMD-Vol. 222/EEP-Vol. 20, Application of Fracture Mechanics in Electronic Packaging, ASME International, pp 97-102.
7. Kanninen, M. F., 1973, "An Augmented Double Cantilever Beam Model for Studying Crack Propagation Arrest", International Journal of Fracture, Vol. 9, pp. 83-92.
8. Kim, K. S., Kim, J., 1988, Transactions of the ASME, "Elasto-Plastic Analysis of the Peel Test for Thin Film Adhesion", Journal of Engineering Materials and Technology, Vol. 110, pp. 266-273.
9. Rice, J. R., 1988, "Elastic Fracture Mechanics Concepts for Interfacial Cracks", Journal of Applied Mechanics, Vol. 55, pp. 98-103.
10. Sha, Y., Hui, C. Y., Kramer, E. J., Hahn, S. F., Berglund, C. A., 1996, "Fracture Toughness and Failure Mechanism of Epoxy/Rubber-Modified Polystyrene (HIPS) Interfaces Reinforced by Grafted Chains", Macromolecules, Vol. 29, pp. 4728-4736.
11. Suo, Z., Hutchinson, J. W., 1990, "Interface Crack Between Two Elastic Layers", International Journal of Fracture, Vol. 43, pp. 1-18.
12. Tummala, R., Ramasawsky, E. J., 1989., "Handbook of Microelectronic Packaging". Von Nostrand Reinhold, NY.
13. Xiao, F., Hui, C. Y., Kramer, E. J., 1993, "Analysis of a Mixed Mode Fracture Specimen: The Asymmetric Double Cantilever Beam", Journal of Materials Science, Vol. 28, pp. 5620-5629.
14. Xiao, F., Hui, C. Y., Washiyama, J., Kramer, E. J., 1994, 'Phase Angle Effects on Fracture Toughness of Polymer Interfaces Reinforced with Block Copolymers', Macromolecules, Vol. 27, pp. 4382-4390.
15. Widerhorn, S. M., 1975, "Crack Growth and Static Fracture", Journal ofNon Crystalline Solids, Vol. 19, pp. 169-181.