Reticle enhancement technology trends: Resource and manufacturability implications for the implementation of physical designs

Proceedings of the International Symposium on Physical Design

Volumn , Issue , 2001, Pages 45-51

  Grobman, W ^a   Boone, R ^a   Philbin, C ^a   Jarvis, B ^a  

^a MOTOROLA INC   (United States)

Author keywords

Mask data preparation; OPC; Phase shift; RET; Reticle Enhancement Technology; Subwavelength lithography; Tiling

Indexed keywords

ALGORITHMS; COMPUTER AIDED DESIGN; DATA STRUCTURES; LITHOGRAPHY; PHASE SHIFT;

RETICLE ENHANCEMENT TECHNOLOGY (RET);

MASKS;

EID: 0034825979     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. IC layout and manufacturability: Critical links and design flow implications
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3. Automated layout and phase assignment techniques for dark field alternating PSM
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5. New graph bipartizations for double-exposure, bright field alternating phase-shift mask layout
6. Model-based dummy feature placement for oxide chemical-mechanical polishing manufacturability
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8. Dummy feature placement for chemical-mechanical polishing uniformity in a shallow trench isolation process
9. New and exact filling algorithms for layout density control
10. An overview of pattern data preparation for vector scan electron beam lithography