Conduction development in electrically conductive adhesives with a bimodal size distributed conducting and inert particles: Effect of polydispersity

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 609-614

  Mikrajuddin, ^a   Shi, F G ^b   Okuyama, K ^a   Kim, H K ^b  

^a HIROSHIMA UNIVERSITY   (Japan)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVES; CONDUCTIVE MATERIALS; PARTICLE SIZE; PERCOLATION (COMPUTER STORAGE); PERCOLATION (FLUIDS); SIZE DISTRIBUTION; VOLUME FRACTION; ELECTRIC CONDUCTIVITY; MATHEMATICAL MODELS; PARTICLE SIZE ANALYSIS; PARTICLES (PARTICULATE MATTER); PERCOLATION (SOLID STATE);

CONDUCTING PARTICLES; CONDUCTIVE ADHESIVE; ELECTRICAL CONDUCTION; ELECTRICAL PERCOLATION THRESHOLD; ELECTRICALLY CONDUCTIVE; ELECTRICALLY CONDUCTIVE ADHESIVES; PERCOLATION THRESHOLDS; THEORETICAL MODELING;

SOLVENTS; ELECTRONICS PACKAGING;

BIMODAL SIZE DISTRIBUTED CONDUCTING PARTICLES; ELECTRICALLY CONDUCTIVE ADHESIVES; INERT PARTICLES; PERCOLATION LIMIT; POLYDISPERSITY;

EID: 0034476256     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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