High sensitive negative silylation process for 193nm lithography

Microelectronic Engineering

Volumn 53, Issue 1, 2000, Pages 485-488

  Endo, M ^a   Satou, I ^a   Watanabe, H ^a   Morimoto, H ^a  

^a SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

MASKS; ORGANIC POLYMERS; PLASMA ETCHING; PLASTIC FILMS; SURFACE ROUGHNESS;

NEGATIVE SILYLATION PROCESS; PHOTOACID GENERATOR; POST EXPOSURE BAKE;

PHOTORESISTS;

EID: 0034206378     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(00)00361-0     Document Type: Article

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