|
Volumn 3333, Issue , 1998, Pages 188-194
|
Negative-tone TSI process for 193-nm lithography
a a a a a a |
Author keywords
193 nm; ArF; Chemically amplified resist; Dry development; High sensitivity; Lithography; Negative tone; Resist; Top surface imaging
|
Indexed keywords
LITHOGRAPHY;
PHOTORESISTORS;
PHOTORESISTS;
REACTIVE ION ETCHING;
THICKNESS MEASUREMENT;
193-NM;
ARF;
CHEMICALLY AMPLIFIED RESIST;
DRY DEVELOPMENT;
HIGH SENSITIVITY;
NEGATIVE-TONE;
RESIST;
TOP SURFACE IMAGING;
SILANES;
|
EID: 0001757286
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.312407 Document Type: Conference Paper |
Times cited : (4)
|
References (6)
|