Lead-free solders in Japan (A personal impression)

Soldering and Surface Mount Technology

Volumn 12, Issue 1, 2000, Pages 32-34

  Plumbridge, W J ^a  

^a OPEN UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT TREATMENT; MATERIALS TESTING; STRESS ANALYSIS; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING;

COHESION;

SOLDERING ALLOYS;

EID: 0033904068     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910010312410     Document Type: Article

References (19)

1. Busso, E.P., Kitano, M. and Kumazawa, T. (1994), "Modelling complex inelastic deformation processes in IC packages solder joints", J. Electronic Packaging, Vol. 116, pp. 6-15.
2. Kariya, Y. and Otsuka, M. (1998a), "Mechanical fatigue characteristics of Sn-3.5 Ag-x (x = Bi, Cu, Zn and In) solder alloys", J. Electronic Materials,Vol. 27, pp. 1229-35.
3. Kariya, Y. and Otsuka, M. (1998b), "Effect of bismuth on isothermal fatigue properties of Sn-3.5 mass% Ag solder alloy", J. Electronic Materials, Vol. 27, pp. 866-70.
4. Kitano, M. and Honda, M. (1997), "Shape prediction of solder bump joint by surface tension analysis and fatigue strength evaluation", in Suhir, E., Shiratori. M., Lee, Y.C. and Subbarayan, G. (Eds), Advances in Electronic Packaging, ASME, New York, NY, pp. 1407-12.
5. Kitano, M., Nishimura, A., Kumazawa, T., Kawai, S. and Shimizu, I. (1993), "Development of structural design aiding system for plastic IC packages by using personal computer", in Hsu, T.R., Bar-Cohen. A. and Nakayama, W. (Eds), Advances in Electronic Packaging, ASME, New York, NY, pp. 481-8.
6. Mukai, M., Takahashi, H. and Kawakami, T. (1999), "Mechanical fatigue tests of solder bumps", Advances in Electronic Packaging, Vol. 1, pp. 449-55.
7. Nakase, H., Suganuma, K. and Nakamura, Y. (1997), "Properties of Sn-Ag binary alloy as lead-free solder and interface microstructure with Cu", J. Japan Inst. Interconnecting and Packaging Electronic Circuits, Vol. 11, pp. 506-9.
8. Plumbridge, W.J. (1997), "Life prediction of solders in electronics - benefiting from previous experience", 9th Int. Conf. on Fracture (ICF9), Sydney, pp. 167-78.
9. Plumbridge, W.J. and Moffatt, J.E. (1999), "The effect of temperature on fatigue-creep interactions in a tin-lead solder", Interconnect PACK Conf., San Diego, CA.
10. Sakuyama, S., Uchida, H., Watanabe, I., Natori, K. and Sato, T. (1998), "Reflow soldering using selective infra-red radiation", International Symposium on Microelectronics, pp. 393-6.
11. Solomon, H.D. (1988), "Low cycle fatigue of lead-tin solders", 38th Electronic Components Conf. IEEE, pp. 7-11.
12. Suganuma, K. and Nakamura, Y. (1995), "Microstructure and strength of interface between Sn-Ag eutectic solder and Cu", J. Japan Inst. Metals, Vol. 59, pp. 1299-1305.
13. Suganuma, K., Niihara, K., Shoutoku, T. and Nakamura (1997), "Wetting and interface microstructure between Sn-Zn binary alloys and Cu", J. Mater. Res. Vol. 13, pp. 2859-65.
14. Tanaka, T., Nishijima, S. and Ichikawa, M. (1987), "Statistical fatigue life estimation: the influence of temperature and composition on low cycle fatigue of tin-lead solders", Current Japanese Research, Vol. 2, pp. 235-50.
15. Tsukada, T., Mashimoto, Y., Nishio, T. and Nii, M. (1992), "Reliability and stress analysis of encapsulated flip chip joint on epoxy base printed circuit board", Proc. ASME/JSME Joint Conf. for Advances in Electronic Packaging, Milpitas, CA, Vol. 2, pp. 827-35.
16. Tsukada, Y., Mizumoto, S. and Kodama, Y., "Advanced multilayer PCB and its packaging", unpublished work.
17. Tsukuda, Y., Nishimura, H., Yamamoto, H. and Sakane, M. (to be published), submitted to trans, "A strain rate ratio approach for assessing creep-fatigue life of 63Sn-37Pb solder under shear loading", J. Electr. Packaging, ASME.
18. Uchida, H., Sakuyama, S., Katsuhide, N., Kawarada, M. and Akai, R. (1998), "Thermal analysis of printed circuit boards for infra-red reflow soldering", International Symposium on Microelectronics, pp. 42-7.
19. Vaynman, S., Fine, M.E. and Jeannotte, D.A. (1988), "Isothermal fatigue of low tin-lead based solder", Metall. Trans., Vol. 19A, pp. 1051-7.