Reflow soldering using selective infrared radiation

Proceedings of the IEEE/CPMT International Electronic Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 1995, Pages 393-396

  Sakuyama, Seiki ^a   Uchida, Hiroki ^a   Watanabe, Isao ^a   Natori, Katsuhide ^a   Sato, Takehiko ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC RESISTANCE; ELECTRONICS PACKAGING; EPOXY RESINS; GLASS; HEATING EQUIPMENT; INFRARED RADIATION; PRINTED CIRCUIT BOARDS; SURFACE MOUNT TECHNOLOGY; TEMPERATURE CONTROL;

ALUMINUM OXIDE HEATER; HALOGEN HEATER; QUAD FLAT PACKAGES; REFLOW SOLDERING; SELECTIVE INFRARED RADIATION; SURFACE MOUNT DEVICES; TEMPERATURE DIFFERENCE;

SOLDERING;

EID: 0029452833     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)