Thermal analysis of printed circuit boards for infrared reflow soldering

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 42-47

  Uchida, Hiroki ^a   Sakuyama, Seiki ^a   Natori, Katsuhide ^a   Kawarada, Motonobu ^a   Akai, Reijiro ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; ENERGY ABSORPTION; HEAT RADIATION; SOLDERING; THERMOANALYSIS;

INFRARED REFLOW SOLDERING;

PRINTED CIRCUIT BOARDS;

EID: 0032311887     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)