Mechanical fatigue tests of solder bumps

American Society of Mechanical Engineers, EEP

Volumn 26 3, Issue , 1999, Pages 449-455

  Mukai, Minoru ^a   Takahashi, Hiroyuki ^a   Kawakami, Takashi ^a   Takahashi, Kuniaki ^a   Iwasaki, Ken ^a   Kishimoto, Kikuo ^b  

^a TOSHIBA CORPORATION   (Japan)

^b TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0345771661     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (11)

1. Hiruta, Y., Hirano, N., Yamaji, Y., Mukai, M., Motoyama, Y., Homma, R., Ohno, J., and Sudo, T., 1993, "An 820 Pin PGA for Ultralarge-Scale BiCMOS Devices," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 16, No. 8, pp.893-901.
2. Kitano, M., Kumazawa, T., and Kawai, S., 1992, "A New Evaluation Method for Thermal Fatigue of Solder Joint," in Advances in Electronic Packaging, Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging, EEP-Vol. 1-1, pp.301-308.
3. Lau, J. H., Rice, D. W., and Avery, P. A., 1987, "Elastoplastic Analysis of Surface-Mount Solder Joints," IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-10, No.3, pp.346-357.
4. Mukai, M., Kawakami, T., Endo, T., and Takahashi, K., 1991. "Elastic-Creep Behavior and Fatigue Life in an IC Package Solder Joint," Proceedings of JSME The 4th Computational Mechanics Conference, No.910-79, pp.223-224.
5. Mukai, M., Kawakami, T., Endo, T., and Takahashi, K., 1992. "The Demonstration on Elastic-Creep Thermal Stress Analyses for IC's 63Sn-37Pb Solder Joints," Proceedings of JSME The 70th JSME Fall Annual Meeting, No. 920-78, pp.360-362.
6. Mukai, M., Kawakami, T., Endo, T., Hiruta, Y., and Takahashi, K., 1994, "Elastic-Creep Thermal Stress Analyses for the SMT-PGA Package's Solder Joint," Proceedings of the ASMEWAM, AMD-Vol.187, pp. 197-203.
7. Mukai, M., Kawakami, T., Takahashi, K., Kishimoto, K. and Shibuya, T., 1997, "Effects of Hold-Time on Thermal Fatigue Life of Solder Joints," Trans. JSME, , 63-611, A, pp. 1594-1600.
8. Mukai, M., Kawakami, T., Takahashi, K., Kishimoto, K., and Shibuya, T., 1998, "Thermal Fatigue Life of Solder Bumps in BGA," JSME International Journal, Vol.41, No.2, A, pp. 260-266.
9. Mukai, M., Kawakami, T., Hiruta, Y., Takahashi, K., Kishimoto, K., and Shibuya, T., 1998, "Fatigue Life Estimation of Solder Joints in SMT-PGA Packages," Trans. ASME, Journal of Electronic Packaging, Vol.120, No.2, pp. 207-212.
10. Yebisuya, T., and Kawakubo, T., 1993, "Creep and Tensile Properties of Cast Bi-Sn, Bi-Pb and Bi-Sn-Pb Solders," J.Japan Inst Metals, Vol. 57, No. 4, pp.455-462.
11. Yu, Q., Shiratori, M., and Wang, S., 1994, "Thermal Conduction and Thermal Stress Analyses of Surface-Mount Assembly with a Solder Joint Element," Proceedings of the ASMEWAM, AMD-Vol. 187, pp. 205-211.