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Volumn 83, Issue 4, 2000, Pages 949-951

Electrical properties of the Ta-RuO2 diffusion barrier for high-density memory devices

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; CRYSTAL MICROSTRUCTURE; DIELECTRIC MATERIALS; ELECTRIC CONTACTS; ELECTRIC RESISTANCE; NANOSTRUCTURED MATERIALS; OXIDATION RESISTANCE; RUTHENIUM COMPOUNDS; TANTALUM;

EID: 0033899152     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2000.tb01301.x     Document Type: Article
Times cited : (7)

References (8)
  • 1
    • 0027911764 scopus 로고
    • Excimer laser ablated barium strontium titanate thin films for dynamic random access memory applications
    • D. Roy and S. B. Krupanidhi, "Excimer Laser Ablated Barium Strontium Titanate Thin Films for Dynamic Random Access Memory Applications," Appl. Phys. Lett., 62 [10] 1056 (1993).
    • (1993) Appl. Phys. Lett. , vol.62 , Issue.10 , pp. 1056
    • Roy, D.1    Krupanidhi, S.B.2
  • 4
    • 0031224155 scopus 로고    scopus 로고
    • Microcrystalline oxide-incorporated new diffusion barrier for dynamic random access memory and ferroelectric random access memory capacitor electrode
    • D.-S. Yoon, S.-M. Lee, and H. K. Baik, "Microcrystalline Oxide-Incorporated New Diffusion Barrier for Dynamic Random Access Memory and Ferroelectric Random Access Memory Capacitor Electrode," J. Vac. Sci. Technol. A, 15 [5] 2781 (1997).
    • (1997) J. Vac. Sci. Technol. A , vol.15 , Issue.5 , pp. 2781
    • Yoon, D.-S.1    Lee, S.-M.2    Baik, H.K.3
  • 7
    • 0013459985 scopus 로고    scopus 로고
    • Effect of interposed Cr layer on the thermal stability of Cu/Ta/Si structure
    • D.-S. Yoon, B.-S. Kang, S.-M. Lee, and H. K. Baik, "Effect of Interposed Cr Layer on the Thermal Stability of Cu/Ta/Si Structure," J. Appl. Phys., 80, 6550 (1996).
    • (1996) J. Appl. Phys. , vol.80 , pp. 6550
    • Yoon, D.-S.1    Kang, B.-S.2    Lee, S.-M.3    Baik, H.K.4
  • 8
    • 0031139284 scopus 로고    scopus 로고
    • The effectiveness of Ta prepared by ion-assisted deposition method as a diffusion barrier between copper and silicon
    • B.-S. Kang, S.-M. Lee, J. S. Kwak, D.-S. Yoon, and H. K. Baik, "The Effectiveness of Ta Prepared by Ion-Assisted Deposition Method as a Diffusion Barrier between Copper and Silicon," J. Electrochem. Soc., 144 [5] 1808 (1997).
    • (1997) J. Electrochem. Soc. , vol.144 , Issue.5 , pp. 1808
    • Kang, B.-S.1    Lee, S.-M.2    Kwak, J.S.3    Yoon, D.-S.4    Baik, H.K.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.