An efficient crosstalk parameter extraction method for high-speed interconnection lines

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 2, 2000, Pages 148-155

  Sung, Myunghee ^a   Ryu, Woonghwan ^a   Kim, Hyungsoo ^a   Kim, Jonghoon ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Crosstalk; Interconnection; Model; Mutual capacitance; Mutual inductance

Indexed keywords

CROSSTALK PARAMETER EXTRACTION; HIGH SPEED INTERCONNECTION LINES; MUTUAL CAPACITANCE; MUTUAL INDUCTANCE;

CAPACITANCE; COMPUTER SIMULATION; CROSSTALK; ELECTRONICS PACKAGING; FEATURE EXTRACTION; MATHEMATICAL MODELS; PROBES; TIME DOMAIN ANALYSIS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0033717428     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.846625     Document Type: Article

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