Embedded microstrip interconnection lines for gigahertz digital circuits

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 3, 2000, Pages 495-503

  Ryu, Woonghwan ^b   Baik, Seung Ho ^c   Kim, Hyungsoo ^c   Kim, Jonghoon ^c   Sung, Myunghee ^c   Kim, Joungho ^a,c  

^a IEEE

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Capacitance; Closed form expressions; Conductance; Embedded microstrip (EM); Inductance; Interconnection line; Inverted embedded microstrip (IEM); Network analysis; On chip; Quasi TEM; Resistance; S parameter

Indexed keywords

CAPACITANCE; DIGITAL INTEGRATED CIRCUITS; ELECTRIC NETWORK ANALYSIS; ELECTRIC RESISTANCE; MICROSTRIP LINES; MIS DEVICES; MULTICHIP MODULES; SCATTERING PARAMETERS; TRANSMISSION LINE THEORY;

EMBEDDED MICROSTRIP; INTERCONNECTION LINES; INVERTED EMBEDDED MICROSTRIP; MICROWAVE NETWORK ANALYSIS; TRANSVERSE ELECTROMAGNETIC;

INTEGRATED CIRCUIT TESTING;

EID: 0034239413     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.861566     Document Type: Article

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