Interconnection line structures on MCM-Si for giga-hertz quasi-TEM signal transmission

Proceedings - Electronic Components and Technology Conference

Volumn Part F133492, Issue , 1998, Pages 1068-1072

  Ryu, Woonghwan ^a   Kim, Hyungsoo ^a   Kim, Jonghoon ^a   Ko, Kyoungmin ^a   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DELAY CIRCUITS; DIGITAL INTEGRATED CIRCUITS; DISPERSION (WAVES); ELECTRIC LINES; NETWORK COMPONENTS; SCATTERING PARAMETERS; ELECTROMAGNETIC WAVE TRANSMISSION; MICROSTRIP LINES; MICROWAVE MEASUREMENT; MIS DEVICES; TRANSMISSION LINE THEORY;

ELECTRICAL PERFORMANCE; HIGH SPEED DIGITAL INTEGRATED CIRCUITS; INTERCONNECTION LINES; MICROSTRIP STRUCTURES; S-PARAMETER MEASUREMENTS; SIGNAL TRANSMISSION; TRANSMISSION BANDWIDTH; TRANSMISSION LINE STRUCTURES;

INTEGRATED CIRCUIT INTERCONNECTS; MULTICHIP MODULES;

EMBEDDING MICROSTRIP STRUCTURES; INTERCONNECTION LINES; INVERTED EMBEDDING MICROSTRIP STRUCTURES;

EID: 0031629058     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.1998.678846     Document Type: Conference Paper

References (8)

1. Bakoglu, "Circuits, Interconnections, Packaging for VLSI", Addison-Wesley, 1990.
2. B. K. Gilbert, G. W. Pan, "MCM Packaging for Present-and Next-Generation High Clock-Rate Digital-and Mixed-Signal Electronic Systems: Areas for Devalopment", IEEE Trans. MTT, vol. 45, no. 10, pp. 1819-1835, Oct. 1997.
3. C. Truzzi, E. Beyne, E. Ringoot, "Performance Analysis of MCM", IEEE Trans. CPMT, vol. 20, no. 3, pp. 334-341, Aug. 1997.
4. Michael Dolle, "A Dynamic Line-Termination Circuit for Multi-receiver Nets", IEEE JSSC, vol. 28, no. 12, pp. 1370-1373, Dec. 1993.
5. H. W. Johnson, "High-Speed Digital Design, A Handbook of Black Magic" pp. 138-148 and pp. 223-248, Prentice Hall, 1993.
6. H. Hasegawa, M. Furukawa, H. Yanai, "Properties of microstrip lines on Si-Si02 system" IEEE Trans. Microwave Theory Tech., vol. MTT-19, pp. 869-g8i7 Nov. 1971.
7. K. C. Gupta, R. Grag, R. Chada, Computer Aided Design of Microwave Circuits. Dedham, MA: Artech House, 1981, pp. 25-43.
8. W. R. Eisenstadt and Y. Eo, "S-parameter-based IC interconnect transmission line characterization, " IEEE Trans. Comp. Hybrid, Manuf. Technol., vol. 15, no. 5, Aug. 1992.