메뉴 건너뛰기




Volumn 18, Issue 1, 1995, Pages 215-225

Simulations and Measurements of Picosecond Signal Transients, Propagation, and Crosstalk on Lossy VLSI Interconnect

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CATHODE RAY OSCILLOSCOPES; COMPUTER SIMULATION; ELECTRIC VARIABLES MEASUREMENT; FOURIER TRANSFORMS; FREQUENCY DOMAIN ANALYSIS; INTERCONNECTION NETWORKS; INVERSE PROBLEMS; MATHEMATICAL MODELS; SPURIOUS SIGNAL NOISE; TIME DOMAIN ANALYSIS; TRANSFER FUNCTIONS;

EID: 0029271355     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.370758     Document Type: Article
Times cited : (8)

References (26)
  • 2
    • 0026137875 scopus 로고
    • Simulation of arbitrary transmission line networks with nonlinear terminations
    • Apr.
    • D. Winklestein, M. B. Steer, and R. Pomerleau, “Simulation of arbitrary transmission line networks with nonlinear terminations,” IEEE Trans. Circuits Syst., vol. 38, no. 4, pp. 418–422, Apr. 1991.
    • (1991) IEEE Trans. Circuits Syst. , vol.38 , Issue.4 , pp. 418-422
    • Winklestein, D.1    Steer, M.B.2    Pomerleau, R.3
  • 3
    • 0024701283 scopus 로고
    • Nonlinear transient analysis of coupled transmission lines
    • July
    • J. E. Schutt-Aine and R. Mittra, “Nonlinear transient analysis of coupled transmission lines,” IEEE Trans. Circuits Syst., vol. 36, no. 7, pp. 959–966, July 1989.
    • (1989) IEEE Trans. Circuits Syst. , vol.36 , Issue.7 , pp. 959-966
    • Schutt-Aine, J.E.1    Mittra, R.2
  • 4
    • 0025452186 scopus 로고
    • High-speed signal propagation on lossy transmission lines
    • July
    • A. Deutsch et al., “High-speed signal propagation on lossy transmission lines,” IBM J. Res. Develop., vol. 34, no. 4, pp. 601–615, July 1990.
    • (1990) IBM J. Res. Develop. , vol.34 , Issue.4 , pp. 601-615
    • Deutsch, A.1
  • 5
    • 0024629335 scopus 로고
    • Modeling of picosecond pulse propagation in microstrip interconnections integrated circuits
    • Mar.
    • K. W. Goosen and R. B. Hamond, “Modeling of picosecond pulse propagationin microstrip interconnections integrated circuits,” IEEE Trans. Microwave Theory Technol., vol. 37, no. 3, pp. 469—478, Mar. 1989.
    • (1989) IEEE Trans. Microwave Theory Technol. , vol.37 , Issue.3 , pp. 469-478
    • Goosen, K.W.1    Hamond, R.B.2
  • 7
    • 0025474888 scopus 로고
    • Crosstalk analysis of interconnect lines and packages in high speed integrated circuits
    • Aug.
    • H. You and M. Soma, “Crosstalk analysis of interconnect lines and packages in high speed integrated circuits,” IEEE Trans. Circuits Syst., vol. 37, no. 8, pp. 1019–1026, Aug. 1990.
    • (1990) IEEE Trans. Circuits Syst. , vol.37 , Issue.8 , pp. 1019-1026
    • You, H.1    Soma, M.2
  • 9
    • 0024626846 scopus 로고
    • Modeling of multiconductor buses and analysis of crosstalk, propagation delay and pulse distortion in high-speed GaAs logic circuits
    • Mar.
    • G. Ghione, I. Maio, and G. Vecchi, “Modeling of multiconductor buses and analysis of crosstalk, propagation delay and pulse distortion in high-speed GaAs logic circuits,” IEEE Trans. Microwave Theory Technol., vol. 37, no. 3, pp. 445–156, Mar. 1989.
    • (1989) IEEE Trans. Microwave Theory Technol. , vol.37 , Issue.3 , pp. 445-156
    • Ghione, G.1    Maio, I.2    Vecchi, G.3
  • 10
    • 0027798939 scopus 로고
    • High speed VLSI interconnect modeling based on S-parameter measurements
    • Aug.
    • Y. Eo and W. R. Eisenstadt, “High speed VLSI interconnect modeling based on S-parameter measurements,” IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 16, no. 5, pp. 555–562, Aug. 1993.
    • (1993) IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol.16 , Issue.5 , pp. 555-562
    • Eo, Y.1    Eisenstadt, W.R.2
  • 11
    • 84946968209 scopus 로고    scopus 로고
    • Generalized interconnect transfer function and high-speed signal simulations
    • accepted for publication
    • _, “Generalized interconnect transfer function and high-speed signal simulations,” IEEE Trans. Microwave Theory Technol., accepted for publication.
    • IEEE Trans. Microwave Theory Technol
  • 12
    • 84936902293 scopus 로고
    • Microwave-measurement-based IC interconnect characterization, modeling, and simulation for high speed VLSI circuit design
    • Gainesville, FL,
    • Y. Eo, “Microwave-measurement-based IC interconnect characterization, modeling, and simulation for high speed VLSI circuit design,” Ph.D. dissertation, University of Florida, Gainesville, FL, 1993.
    • (1993) Ph.D. dissertation, University of Florida
    • Eo, Y.1
  • 13
    • 0015563204 scopus 로고
    • Crosstalk in uniformly coupled lossy transmission line
    • Jan.
    • J. C. Isaacs, Jr., and N. A. Strakhov, “Crosstalk in uniformly coupled lossy transmission line,” Bell Syst. Tech. J., vol. 52, no. 1, pp. 101–115, Jan. 1973.
    • (1973) Bell Syst. Tech. J , vol.52 , Issue.1 , pp. 101-115
    • Isaacs, J.C.1    Strakhov, N.A.2
  • 14
    • 0020113452 scopus 로고
    • Modeling of high-speed, large-signal transistor switching transients from S-parameter measurements
    • Apr.
    • Y. Ikawa, W. R. Eisenstadt, and R. W. Dutton, “Modeling of high-speed, large-signal transistor switching transients from S-parameter measurements,” IEEE Trans. Electron Devices, vol. ED-29, no. 4, pp. 669–675, Apr. 1982.
    • (1982) IEEE Trans. Electron Devices , vol.ED-29 , Issue.4 , pp. 669-675
    • Ikawa, Y.1    Eisenstadt, W.R.2    Dutton, R.W.3
  • 15
    • 0020704286 scopus 로고
    • Simple formula for two- and three-dimensional capacitances
    • Feb.
    • T. Sakurai and K. Tamaru, “Simple formula for two- and three-dimensional capacitances,” IEEE Trans. Electron Devices, vol. ED-30, no. 2, pp. 183–185, Feb. 1983.
    • (1983) IEEE Trans. Electron Devices , vol.ED-30 , Issue.2 , pp. 183-185
    • Sakurai, T.1    Tamaru, K.2
  • 16
    • 0014710239 scopus 로고
    • Calculation of coefficients of capacitance multiconductor transmission lines in the presence of a dielectric interface
    • Jan.
    • W. T. Weeks, “Calculation of coefficients of capacitance multiconductor transmission lines in the presence of a dielectric interface,” IEEE Trans. Microwave Theory Technol., vol. MTT-18, no. 1, pp. 35–43, Jan. 1970.
    • (1970) IEEE Trans. Microwave Theory Technol. , vol.MTT-18 , Issue.1 , pp. 35-43
    • Weeks, W.T.1
  • 17
    • 0021410793 scopus 로고
    • Multiconductor transmission lines in multilayered dielectric media
    • Apr.
    • C. Wei, R. F. Harrington, J. R. Mautz, and T. K. Sarkar, “Multiconductor transmission lines in multilayered dielectric media,” IEEE Trans. Microwave Theory Technol., vol. 32, no. 4, pp. 439—450, Apr. 1984.
    • (1984) IEEE Trans. Microwave Theory Technol. , vol.32 , Issue.4 , pp. 439-450
    • Wei, C.1    Harrington, R.F.2    Mautz, J.R.3    Sarkar, T.K.4
  • 18
    • 0024684777 scopus 로고
    • Calculation of electrical parameters of a thin-film multichip package
    • June
    • D. Nayak, L.T. Hwang, and I. Turlik, “Calculation of electrical parameters of a thin-film multichip package,” IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 12, no. 2, pp. 303–369, June 1989.
    • (1989) IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol.12 , Issue.2 , pp. 303-369
    • Nayak, D.1    Hwang, L.T.2    Turlik, I.3
  • 19
    • 0020276069 scopus 로고
    • A simple formula for the estimation of the capacitance of two-dimensional interconnects in VLSI circuits
    • Dec.
    • C.P. Yuan and T. N. Trick, “A simple formula for the estimation of the capacitance of two-dimensional interconnects in VLSI circuits,” IEEE Electron Device Lett., vol. EDL-3, no. 12, pp. 391–393, Dec. 1982.
    • (1982) IEEE Electron Device Lett. , vol.EDL-3 , Issue.12 , pp. 391-393
    • Yuan, C.P.1    Trick, T.N.2
  • 20
    • 0026626371 scopus 로고
    • Multilevel metal capacitance model for CAD design synthesis systems
    • Jan.
    • J.H. Chern, J. Huang, L. Arledge, P.C. Li, and P. Yang, “Multilevel metal capacitance model for CAD design synthesis systems,” IEEE Electron Devices Lett., vol. 13, no. 1, pp. 32–34, Jan. 1992.
    • (1992) IEEE Electron Devices Lett. , vol.13 , Issue.1 , pp. 32-34
    • Chern, J.H.1    Huang, J.2    Arledge, L.3    Li, P.C.4    Yang, P.5
  • 22
    • 84946967220 scopus 로고
    • IC interconnect capacitance and conductance determination
    • Y. Eo and W. R. Eisenstadt, “IC interconnect capacitance and conductance determination,” in Proc. SRC TECHON 90, 1990.
    • (1990) Proc. SRC TECHON 90
    • Eo, Y.1    Eisenstadt, W.R.2
  • 23
    • 0025533655 scopus 로고
    • Measured capacitance coefficients of multiconductor microstrip lines with small dimensions
    • Dec.
    • M.S. Lin, “Measured capacitance coefficients of multiconductor microstrip lines with small dimensions,” IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 13, no. 4, pp. 1050–1054, Dec. 1990.
    • (1990) IEEE Trans. Comp., Hybrids, Manufact. Technol. , vol.13 , Issue.4 , pp. 1050-1054
    • Lin, M.S.1
  • 24
    • 0025522078 scopus 로고
    • Measurements of transient response on lossy microstrip with small dimensions
    • Nov.
    • M.S. Lin, A. H. Engvik, and J. S. Loos, “Measurements of transient response on lossy microstrip with small dimensions,” IEEE Trans. Circuits Syst., vol. 37, no. 11, pp. 1383–1393, Nov. 1990.
    • (1990) IEEE Trans. Circuits Syst. , vol.37 , Issue.11 , pp. 1383-1393
    • Lin, M.S.1    Engvik, A.H.2    Loos, J.S.3
  • 26
    • 84946967900 scopus 로고
    • HP5412IT Digitizing Oscilloscope Front-Panel Operation Reference
    • Santa Rosa, CA, Publication 5090–4309
    • HP5412IT Digitizing Oscilloscope Front-Panel Operation Reference, Hewlett Packard Corp., Santa Rosa, CA, 1990, Publication 5090–4309.
    • (1990) Hewlett Packard Corp


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.