High-Speed VLSI Interconnect Modeling Based on S-Parameter Measurements

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 5, 1993, Pages 555-562

  Eo, Yungseon ^a   Eisenstadt, William R ^a  

^a UNIVERSITY OF FLORIDA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; NUMERICAL METHODS;

CAPACITIVE FRINGING; INTERCONNECT CIRCUIT PARAMETERS; S-PARAMETER MEASUREMENT; SOFTWARE PACKAGE PISCES-II; SUBSTRATE CONDUCTANCE;

VLSI CIRCUITS;

EID: 0027798939     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.239889     Document Type: Article

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