Directly Deposited Fluxless Lead-Indium-Gold Composite Solder

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Volumn 16, Issue 8, 1993, Pages 789-793

  Wang, Chen Y ^a   Chen, Yi C ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACOUSTIC MICROSCOPES; COMPOSITE MATERIALS; LEAD ALLOYS; PHASE DIAGRAMS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING GALLIUM ARSENIDE; THERMAL EFFECTS;

FLUXLESS SOLDERS; SCANNING ACOUSTIC MICROSCOPES;

SOLDERING ALLOYS;

EID: 0027843349     PISSN: 01486411     EISSN: None     Source Type: Journal    
DOI: 10.1109/33.273675     Document Type: Article

References (20)

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