Multilayer tin-silver composite solders deposited in high vacuum

Proceedings of the International Electronics Packaging Conference

Volumn , Issue , 1995, Pages 258-264

  Chen, Yi Chia ^a   Lee, Chin C ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SILVER ALLOYS; SOLDERING; SUBSTRATES; TIN ALLOYS; VACUUM APPLICATIONS; X RAY ANALYSIS;

ENERGY DISPERSIVE X RAY ANALYSIS; MULTILAYER TIN SILVER COMPOSITE SOLDERS; SCANNING ACOUSTIC MICROSCOPES;

SOLDERED JOINTS;

EID: 0029452238     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)