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Journal of Electronic Materials

Volumn 18, Issue 2, 1989, Pages 327-337

Void-free Au-Sn eutectic bonding of GaAs dice and its characterization using scanning acoustic microscopy

(2) Matljasevic, Goran a Lee, Chin C a

a UNIVERSITY OF CALIFORNIA (United States)

Author keywords

acoustic mircoscope; bonding; Die attachment; eutectic

Indexed keywords

EID: 51249172449 PISSN: 03615235 EISSN: 1543186X Source Type: Journal
DOI: 10.1007/BF02657425 Document Type: Article

Times cited : (61)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.