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Volumn 2882, Issue , 1996, Pages 49-52
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Stacked multichip-module technology for high-performance intelligent transducers
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Author keywords
[No Author keywords available]
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Indexed keywords
EUTECTIC SOLDER BUMP BONDING;
MICROMECHANICAL TRANSDUCERS;
MULTICHIP MODULES;
BONDING;
ELECTRODEPOSITION;
MICROELECTRONICS;
MICROMACHINING;
MODULAR CONSTRUCTION;
PERFORMANCE;
PHOTORESISTS;
SOLDERING;
TECHNOLOGY;
TRANSDUCERS;
INTELLIGENT STRUCTURES;
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EID: 0030401546
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
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Times cited : (5)
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References (4)
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