Modularized microelectromechanical devices as key components for advanced intelligent autonomous sensors and control systems

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3201, Issue , 1998, Pages 108-123

  Schuenemann, Matthias ^a   Grosser, Volker ^b   Leutenbauer, Rudolf ^b   Matuscheck, Peter ^a   Schaefer, Wolfgang ^a   Reichl, Herbert ^b  

^a FRAUNHOFER INSTITUTE FOR MANUFACTURING ENGINEERING AND AUTOMATION IPA   (Germany)

^b Department of Mechanical Reliability in Microtechnology   (Germany)

Author keywords

Autonomous control systems; Intelligent sensors; Interfaces; Medium scale production; Microelectromechanical systems; Modularization; Packaging; Standardization; TB 2GA

Indexed keywords

AUTONOMOUS CONTROL SYSTEMS; INTELLIGENT SENSORS; INTERFACES; MEDIUM-SCALE PRODUCTION; MICROELECTROMECHANICAL SYSTEMS; MODULARIZATION; PACKAGING; TB 2GA;

COMPOSITE MICROMECHANICS; CONTROL SYSTEM ANALYSIS; ELECTROMECHANICAL DEVICES; GENETIC ALGORITHMS; INTELLIGENT CONTROL; MACROS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMECHANICS; MODULAR CONSTRUCTION; SENSORS; SMART SENSORS; STANDARDIZATION; TERBIUM ALLOYS;

CONTROL SYSTEMS;

EID: 58849144283     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.298007     Document Type: Conference Paper

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