Reliability and properties of PZT thin films for MEMS applications

Materials Research Society Symposium - Proceedings

Volumn 546, Issue , 1999, Pages 153-158

  Bahr, D F ^a   Merlino, J C ^a   Banerjee, P ^a   Yip, C M ^b   Bandyopadhyay, A ^b  

^a Washington State University   (United States)

^b UNIVERSITY OF TORONTO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DELAMINATION; DEPOSITION; HARDNESS; LEAD COMPOUNDS; MICROELECTROMECHANICAL DEVICES; PIEZOELECTRIC MATERIALS; SILICON; SINTERING; SUBSTRATES; THIN FILMS;

NANOINDENTATION;

DIELECTRIC FILMS;

EID: 0033324047     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. . D.L. Polla and L.F. Francis, Annu. Rev. Mater. Sci., 28, 563 (1998).
2. . D.L. Polla and L.F. Francis, MRS Bull., 21, #7, 59, (1996).
3. . W.P. Robbins, Int. Ferroelect., 11, 179 (1995).
4. Y.L. Tu and S.J.Milne.J. Mater. Res., 10, 3222 (1995).
5. . K.D. Budd, S.K. Dey, and D.A. Payne, Br. Ceram. Proc., 36, 107 (1985).
6. . M.J. Lefevre, J.S. Speck, R.W. Schwanz, D. Dimos, and S.J. Lockwood, J. Mater. Res., 11,2076(1996).
7. . D.F. Bahr, J.W. Hoehn, N.R. Moody and W.W. Gerberich, Acta Mater., 45, 5163 (1997)
8. . D.F. Bahr, J.S. Robach, J.S. Wright, L.F. Francis, and W.W. Gerberich, Mater. Sci. Eng. AA259, 126(1999).
9. . R.W. Schwanz, J.A. Voigt, B.A. Tuttle, D.A. Payne, T.L. Reichert, and R.D. DaSalla, J. Mater. Res., 12,444(1997)