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Volumn 7, Issue 2, 1999, Pages 157-168

Three-dimensional photoresist etching simulator for TCAD

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER AIDED ENGINEERING; COMPUTER SIMULATION; ETCHING; FUNCTIONS;

EID: 0032659076     PISSN: 09650393     EISSN: None     Source Type: Journal    
DOI: 10.1088/0965-0393/7/2/002     Document Type: Article
Times cited : (16)

References (21)
  • 2
    • 0030379795 scopus 로고    scopus 로고
    • An industrial perspective of technology CAD for advanced CMOS technologies
    • Bold B S 1996 An industrial perspective of technology CAD for advanced CMOS technologies Microelectron. Eng. 34 65-9
    • (1996) Microelectron. Eng. , vol.34 , pp. 65-69
    • Bold, B.S.1
  • 9
    • 0031655217 scopus 로고    scopus 로고
    • The future of lithography after 193 nm optics
    • Mackay R S 1998 The future of lithography after 193 nm optics Microelectron. Eng. 41/42 71-4
    • (1998) Microelectron. Eng. , vol.41-42 , pp. 71-74
    • Mackay, R.S.1
  • 10
    • 0029378440 scopus 로고
    • Simulation of the two-dimensional photoresist etching process in integrated circuit fabrication using cellular automata
    • Karafyllidis I and Thanailakis A 1995 Simulation of the two-dimensional photoresist etching process in integrated circuit fabrication using cellular automata Modelling Simul. Mater. Sci. Eng. 3 629-42
    • (1995) Modelling Simul. Mater. Sci. Eng. , vol.3 , pp. 629-642
    • Karafyllidis, I.1    Thanailakis, A.2
  • 11
    • 0030086631 scopus 로고    scopus 로고
    • Simulation of the image reversal submicron process in integrated circuit fabrication
    • Karafyllidis I and Thanailakis A 1996 Simulation of the image reversal submicron process in integrated circuit fabrication Semicond. Sci. Technol. 11 214-20
    • (1996) Semicond. Sci. Technol. , vol.11 , pp. 214-220
    • Karafyllidis, I.1    Thanailakis, A.2
  • 12
    • 0031235775 scopus 로고    scopus 로고
    • Simulation of the negative chemical amplification deep-ultraviolet process in integrated circuit fabrication
    • Karafyllidis I 1997 Simulation of the negative chemical amplification deep-ultraviolet process in integrated circuit fabrication Microelectron. Eng. 34 155-70
    • (1997) Microelectron. Eng. , vol.34 , pp. 155-170
    • Karafyllidis, I.1
  • 14
    • 0001368709 scopus 로고    scopus 로고
    • Developer temperature effect on negative deep ultraviolet resists: Characterization modeling and simulation
    • Hagouel P I, Karafyllidis I and Neureuther A R 1997 Developer temperature effect on negative deep ultraviolet resists: characterization modeling and simulation J. Vacuum Sci. Technol. B 15 2616-20
    • (1997) J. Vacuum Sci. Technol. B , vol.15 , pp. 2616-2620
    • Hagouel, P.I.1    Karafyllidis, I.2    Neureuther, A.R.3
  • 15
    • 0031655497 scopus 로고    scopus 로고
    • Dependence of developed negative resist profiles on exposure energy dose: Experiment modeling and simulation
    • Hagouel P I, Karafyllidis I and Neureuther A R 1998 Dependence of developed negative resist profiles on exposure energy dose: experiment modeling and simulation Microelectron. Eng. 41/42 351-4
    • (1998) Microelectron. Eng. , vol.41-42 , pp. 351-354
    • Hagouel, P.I.1    Karafyllidis, I.2    Neureuther, A.R.3
  • 16
    • 0000205870 scopus 로고    scopus 로고
    • Negative resist profiles in 248 nm photolithography: Experiment, modelling and simulation
    • Karafyllidis I, Hagouel P I and Neureuther A R 1998 Negative resist profiles in 248 nm photolithography: experiment, modelling and simulation Semicond. Sci. Technol. 13 603-10
    • (1998) Semicond. Sci. Technol. , vol.13 , pp. 603-610
    • Karafyllidis, I.1    Hagouel, P.I.2    Neureuther, A.R.3
  • 19


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.