Negative resist corner rounding. Envelope volume modeling

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 14, Issue 6, 1996, Pages 4257-4261

  Hagouel, Paul Isaac L ^a   Neureuther, Andrew R ^b   Zenk, Andrew M ^b  

^a University of California ^*  (Greece)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0012694876     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.588586     Document Type: Article

References (12)

1. D. R. Miller and C. W. Macosko, J. Polym. Sci. B Polym. Phys. 26, 1 (1988).
2. E. A. Puttlitz, J. P. Collins, T. M. Glynn, and L. L. Linehan, Adv. Resist Technol. Proc. XII Proc. SPIE 2438, 571 (1995).
3. R. Ferguson, Ph.D. dissertation, Memorandum No. UCB/ERL M91/78, University of California, Berkeley, 1991.
4. A. Zenk, A. R. Neureuther, S. M. Lee, and J. M. J. Fréchet, J. Vacuum Sci. Technol. B 12, 3851 (1994).
5. C. Willson, Introduction to Microlithography, 2nd ed., edited by L. Thompson, C. Willson, and M. Bowden (American Chemical Society, Washington, DC, 1994).
6. P. I. Hagouel, Research Report, Memorandum No. UCB/ERL M95/72, University of California, Berkeley, 1995.
7. A. R. Neureuther, R. H. Wang, J. J. Heimsen, J. S. Sefler, E. W. Scheckler, R. Gunturi, and R. Winterbottom, SISDEP '95 International Workshop on 3-Dimensional Process Simulation, Erlangen, Germany, 5 September 1995.
8. K. H. Toh, A. R. Neureuther, and E. W. Scheckler, IEEE Trans. Comput. Aided Design Integrated Circuits Syst. 13, 616 (1994).
9. E. W. Scheckler, N. N. Tam, A. K. Pfau, and A. R. Neureuther, IEEE Trans. Comput. Aided Design Integrated Circuits Syst. 12, 1345 (1993).
10. E. Strasser and S. Selberherr, IEEE Trans. Computer Aided Design Integrated Circuits Syst. 14, 1104 (1995).
11. I. Karafyllidis and A. Thanailakis, Modelling Sim. Mater. Sci. Eng. 3, 629 (1995).
12. I. Karafyllidis and A. Thanailakis, Semiconductor Sci. Technol. 11, 214 (1996).