A 10 Gb/s hybrid-integrated receiver array module using a planar lightwave circuit (PLC) platform including a novel assembly region structure

Journal of Lightwave Technology

Volumn 14, Issue 11, 1996, Pages 2475-2482

  Mino, Shinji ^a,b,c,d   Ohyama, Takaharu ^b,e,f   Akahori, Yuji ^a,b,c,d,g   Hashimoto, Toshikazu ^b,h,i   Yamada, Yasufumi ^a,b,c   Yanagisawa, Masahiro ^b   Muramoto, Yoshifumi ^b,g,j  

^a IEEE

^b NTT CORPORATION   (Japan)

^c WASEDA UNIVERSITY   (Japan)

^d UNIVERSITY OF TOKYO   (Japan)

^e KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

^f KYUSHU UNIVERSITY   (Japan)

^g JAPAN SOCIETY OF APPLIED PHYSICS   (Japan)

^h HOKKAIDO UNIVERSITY   (Japan)

ⁱ National Laboratory for High Energy Physics   (Japan)

^j Osaka City University

more..

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CAPACITANCE; FREQUENCY DIVISION MULTIPLEXING; INTEGRATED OPTOELECTRONICS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; SIGNAL RECEIVERS; VIDEO SIGNAL PROCESSING;

HYBRID INTEGRATED RECEIVER ARRAY MODULES; MONOLITHIC OPTOELECTRONIC INTEGRATED CIRCUITS (OEIC); OPTICAL CHIPS; PLANAR LIGHTWAVE CIRCUIT (PLC) PLATFORMS; WAVELENGTH MULTIPLEXERS;

OPTICAL COMMUNICATION EQUIPMENT;

EID: 0030287947     PISSN: 07338724     EISSN: None     Source Type: Journal    
DOI: 10.1109/50.548144     Document Type: Article

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