Flip-Chip packaging with polymer bumps

Semiconductor International

Volumn 20, Issue 2, 1997, Pages 103-108

  Estes, Richard H ^a  

^a Epoxy Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; CONDUCTIVE MATERIALS; FLIP CHIP DEVICES; LOW TEMPERATURE OPERATIONS; PASSIVATION; PERFORMANCE; POLYMERS; RELIABILITY; SCREEN PRINTING; SILICON WAFERS;

CONDUCTIVE POLYMERS; FLIP CHIP PACKAGING; POLYMER BUMPS; SCREEN PRINTERS; STENCIL PRINTERS;

ELECTRONICS PACKAGING;

EID: 0031075819     PISSN: 01633767     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (3)

1. R. Estes and R. Pernice, "Die Attach Adhesives: Evaluation of VceSat and Thermal Resistance Performance in Power Devices," ISHM Proceedings, 1989.
2. R. Estes, "Polymer Flip-Chip: A Technology Assessment of Solderless Bump Processes and Reliability," IEPS Proceedings, 1994.
3. F.W. Kulesza, R. Estes, and K. Spanjer, "A Screen Printable Polyimide Coating for Silicon Wafers," Solid State Technology, 1988.