Tolerance analysis for three-dimensional optoelectronic systems packaging

Optical Engineering

Volumn 35, Issue 7, 1996, Pages 2034-2044

  Morozov, Valentin N ^a   Lee, Yung Cheng ^a   Neff, John A ^a   O'Brien, D ^a   McLaren, Timothy S ^a   Zhou, Haijun ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

3 d computer; Flip chip assembly; Free space optical interconnects; Optoelectronic packaging; Smart pixel array; Vertical cavity surface emitting lasers (vcsel)

Indexed keywords

EID: 0041795715     PISSN: 00913286     EISSN: None     Source Type: Journal    
DOI: 10.1117/1.600782     Document Type: Article

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