-
1
-
-
0030412794
-
Manufacturability demonstration of an integrated SiGe HBT technology for the analog and wireless marketplacein
-
1996, pp. 859-862.
-
D. C. Ahlgren, M. Gilbert, D. Greenberg, S. J. Jeng, J. Malinowski, D. Nguyen-Ngoc, K. Schonenberg, K. Stein, R. Groves, K. Walter, G. Hueckel, D. Colavito, G. Freeman, D. Sunderland, D. L. Harame, and B. Meyerson, "Manufacturability demonstration of an integrated SiGe HBT technology for the analog and wireless marketplacein IEDM Tech. Dig., 1996, pp. 859-862.
-
IEDM Tech. Dig.
-
-
Ahlgren, D.C.1
Gilbert, M.2
Greenberg, D.3
Jeng, S.J.4
Malinowski, J.5
Nguyen-Ngoc, D.6
Schonenberg, K.7
Stein, K.8
Groves, R.9
Walter, K.10
Hueckel, G.11
Colavito, D.12
Freeman, G.13
Sunderland, D.14
Harame, D.L.15
Meyerson, B.16
-
2
-
-
0030387394
-
Process integration technologies for an 0.3-μm BiCMOS SRAM with 1.5-V operationin
-
1996, pp. 89-92.
-
H. Suzuki, H. Yoshida, T. Yamazaki, K. Takeda, S. Kuhara, and H. Toyoshima, "Process integration technologies for an 0.3-μm BiCMOS SRAM with 1.5-V operationin Proc BCTM. 1996, pp. 89-92.
-
Proc BCTM.
-
-
Suzuki, H.1
Yoshida, H.2
Yamazaki, T.3
Takeda, K.4
Kuhara, S.5
Toyoshima, H.6
-
3
-
-
0030389416
-
A 0.5-μ,m BiCMOS technology for low-power wireless telecommunications applicationsin
-
1996, pp. 126-129.
-
C. Blair, T. Luk, J. Darmawan, and D. Bien, "A 0.5-μ,m BiCMOS technology for low-power wireless telecommunications applicationsin Proc. BCTM. 1996, pp. 126-129.
-
Proc. BCTM.
-
-
Blair, C.1
Luk, T.2
Darmawan, J.3
Bien, D.4
-
4
-
-
0030409637
-
0.8-//m BiCMOS process with high resistivity substrate for L-band Si-MMIC applicationsin
-
1996, pp. 134-137.
-
T. Nakashima, S. Kubo, Y. Otsu, T. Ikeda, N. Suematsu, M. Yamawaki, and T. Hirao, "0.8-//m BiCMOS process with high resistivity substrate for L-band Si-MMIC applicationsin Proc. BCTM. 1996, pp. 134-137.
-
Proc. BCTM.
-
-
Nakashima, T.1
Kubo, S.2
Otsu, Y.3
Ikeda, T.4
Suematsu, N.5
Yamawaki, M.6
Hirao, T.7
-
5
-
-
0030398649
-
SiGe-technology and components for mobile communication systemsin
-
1996, pp. 130-133.
-
A. Schuppen, H. Dietrich, S. Gerlach, H. Höhnemann, J. Arndt, U. Seiler, R. Götzfried, T. Erben, and H. Schumacher, "SiGe-technology and components for mobile communication systemsin Proc. BCTM, 1996, pp. 130-133.
-
Proc. BCTM
-
-
Schuppen, A.1
Dietrich, H.2
Gerlach, S.3
Höhnemann, H.4
Arndt, J.5
Seiler, U.6
Götzfried, R.7
Erben, T.8
Schumacher, H.9
-
6
-
-
0029536454
-
SiGe HBT technology: Device and application issuesin
-
1995, pp. 731-734.
-
D. Harame, L. Larson, M. Case, S. Kovacic, S. Voinigescu, T. Tewksbury, D. Nguyen-Ngoc, K. Stein, J. Cressler, S.-J. Jeng, J. Malinowski, R. Groves, E. Eid, D. Sunderland, D. Rensch, M. Gilbert, K. Schonenberg, D. Ahlgren, S. Rosenbaum, J. Glenn, and B. Meyerson, "SiGe HBT technology: Device and application issuesin IEDM Tech Dig., 1995, pp. 731-734.
-
IEDM Tech Dig.
-
-
Harame, D.1
Larson, L.2
Case, M.3
Kovacic, S.4
Voinigescu, S.5
Tewksbury, T.6
Nguyen-Ngoc, D.7
Stein, K.8
Cressler, J.9
Jeng, S.-J.10
Malinowski, J.11
Groves, R.12
Eid, E.13
Sunderland, D.14
Rensch, D.15
Gilbert, M.16
Schonenberg, K.17
Ahlgren, D.18
Rosenbaum, S.19
Glenn, J.20
Meyerson, B.21
more..
-
7
-
-
0029485957
-
AIDE (Angle-Implanted Drain and Emitter): A BiCMOS technology module for mixed-signal applicationsin
-
1995, pp. 146-149.
-
H. S. Chen, J. Zhao, C. S. Teng, and L. Y. Leu, "AIDE (Angle-Implanted Drain and Emitter): A BiCMOS technology module for mixed-signal applicationsin Proc. BCTM. 1995, pp. 146-149.
-
Proc. BCTM.
-
-
Chen, H.S.1
Zhao, J.2
Teng, C.S.3
Leu, L.Y.4
-
8
-
-
0029532543
-
A 200-mm SiGe-HBT BiCMOS technology for mixed signal applicationsin
-
1995, pp. 89-92.
-
D. Nguyen-Ngoc, D. L. Harame, J. C. Malinowski, S. J. Jeng, K. T. Schonenberg, M. M. Gilbert, G. D. Berg, S. Wu, M. Souyer, K. A. Tallman, K. J. Stein, R. A. Groves, S. Subbanna, D. B. Colavito, D. A. Sunderland, and B. S. Meyerson, "A 200-mm SiGe-HBT BiCMOS technology for mixed signal applicationsin Proc. BCTM, 1995, pp. 89-92.
-
Proc. BCTM
-
-
Nguyen-Ngoc, D.1
Harame, D.L.2
Malinowski, J.C.3
Jeng, S.J.4
Schonenberg, K.T.5
Gilbert, M.M.6
Berg, G.D.7
Wu, S.8
Souyer, M.9
Tallman, K.A.10
Stein, K.J.11
Groves, R.A.12
Subbanna, S.13
Colavito, D.B.14
Sunderland, D.A.15
Meyerson, B.S.16
-
9
-
-
0029271548
-
A high-performance super self-aligned 3V/5-V BiCMOS technology with extremely low parasitics for low-power mixed-signal applicationsin
-
vol. 42, pp. 513-521, Mar. 1995.
-
J. M. Sung, T. Y. Chiu, K. Lau, T. M. Liu, V. D. Archer, B. Razavi, R. G. Swartz, F. M. Erceg, J. T. Glick, G. R. Hower, S. A. Krafty, A. J. Laduca, M. P. Ling, K. G. Moreschel, W. A. Possanza, M. A. Prozonic, and T. P. Long, "A high-performance super self-aligned 3V/5-V BiCMOS technology with extremely low parasitics for low-power mixed-signal applicationsin IEEE Trans. Electron Devices, vol. 42, pp. 513-521, Mar. 1995.
-
IEEE Trans. Electron Devices
-
-
Sung, J.M.1
Chiu, T.Y.2
Lau, K.3
Liu, T.M.4
Archer, V.D.5
Razavi, B.6
Swartz, R.G.7
Erceg, F.M.8
Glick, J.T.9
Hower, G.R.10
Krafty, S.A.11
Laduca, A.J.12
Ling, M.P.13
Moreschel, K.G.14
Possanza, W.A.15
Prozonic, M.A.16
Long, T.P.17
-
10
-
-
0028737553
-
Process integration technology for sub-30-ps ECL BiCMOS using heavily boron-doped epitaxial contact (HYDECC)in
-
1994, pp. 44144.
-
Y. Kinoshita, K. Imai, H. Yoshida, H. Suzuki, T. Tatsumi, and T. Yamazaki, "Process integration technology for sub-30-ps ECL BiCMOS using heavily boron-doped epitaxial contact (HYDECC)in IEDM Tech. Dig., 1994, pp. 44144.
-
IEDM Tech. Dig.
-
-
Kinoshita, Y.1
Imai, K.2
Yoshida, H.3
Suzuki, H.4
Tatsumi, T.5
Yamazaki, T.6
-
11
-
-
0028589852
-
A very-low RF noise and high-performance (4.8 fl) bipolar device in an 0.35-ftm high-density BiCMOS SRAM technologyin
-
1994, pp. 161-162.
-
R. C. Taft, J. H. Lin, F. Shapiro, D. Bockelman, and N. Camilleri, "A very-low RF noise and high-performance (4.8 fl) bipolar device in an 0.35-ftm high-density BiCMOS SRAM technologyin Proc. Symp. VLSI Tech. Dig., 1994, pp. 161-162.
-
Proc. Symp. VLSI Tech. Dig.
-
-
Taft, R.C.1
Lin, J.H.2
Shapiro, F.3
Bockelman, D.4
Camilleri, N.5
-
12
-
-
0028743824
-
A single-poly BiCMOS technology with 30-GHz bipolar /Tin
-
1994, pp. 234-237.
-
C. H. Wang and J. van der Velden, "A single-poly BiCMOS technology with 30-GHz bipolar /Tin Proc. BCTM, 1994, pp. 234-237.
-
Proc. BCTM
-
-
Wang, C.H.1
Van Der Velden, J.2
-
13
-
-
33748174450
-
A double-polysilicon self-aligned npn bipolar process (ADRF) with optional NMOS transistors for RF and analog applicationsin
-
1994, pp. 221-224.
-
O. Kenneth, P. Garone, C. Tsai, B. Scharf, M. Higgins, D. Mai, C. Kermarrec, and J. Yasaitis, "A double-polysilicon self-aligned npn bipolar process (ADRF) with optional NMOS transistors for RF and analog applicationsin Proc. BCTM, 1994, pp. 221-224.
-
Proc. BCTM
-
-
Kenneth, O.1
Garone, P.2
Tsai, C.3
Scharf, B.4
Higgins, M.5
Mai, D.6
Kermarrec, C.7
Yasaitis, J.8
-
14
-
-
0028757703
-
A high-performance CBiCMOS with novel self-aligned vertical PNP transistorsin
-
1994, pp. 238-241.
-
T. Ikeda, T. Nakashima, S. Kubo, H. Jouda, and M. Yamasaki, "A high-performance CBiCMOS with novel self-aligned vertical PNP transistorsin Proc. BCTM, 1994, pp. 238-241.
-
Proc. BCTM
-
-
Ikeda, T.1
Nakashima, T.2
Kubo, S.3
Jouda, H.4
Yamasaki, M.5
-
15
-
-
0028746031
-
Process integration technology for low process complexity BiCMOS using trench collector sinkin
-
1994, pp. 230-233.
-
H. Yoshida, H. Suzuki, Y. Kinoshita, K. Imai, T. Akimoto, K. Tokashi, and Y. Yamazaki, "Process integration technology for low process complexity BiCMOS using trench collector sinkin Proc. BCTM, 1994, pp. 230-233.
-
Proc. BCTM
-
-
Yoshida, H.1
Suzuki, H.2
Kinoshita, Y.3
Imai, K.4
Akimoto, T.5
Tokashi, K.6
Yamazaki, Y.7
-
16
-
-
0029509268
-
A 62.8-GHz /max LP-CVD epitaxially grown silicon base bipolar transistor with extremely high Early voltage of 85.7 Vin
-
1995, pp. 131-132.
-
C. Yoshino, K. Inou, S. Matsuda, H. Nakajima, Y. Tsuboi, H. Naruse, H. Sugaya, Y. Katsumata, and H. Iwai, "A 62.8-GHz /max LP-CVD epitaxially grown silicon base bipolar transistor with extremely high Early voltage of 85.7 Vin Proc. Symp. VLSI Tech. Dig., 1995, pp. 131-132.
-
Proc. Symp. VLSI Tech. Dig.
-
-
Yoshino, C.1
Inou, K.2
Matsuda, S.3
Nakajima, H.4
Tsuboi, Y.5
Naruse, H.6
Sugaya, H.7
Katsumata, Y.8
Iwai, H.9
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