Flip chip bonding technology using gold pillars for millimeter-wave applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 731-734

  Aoki, S ^a   Someta, H ^a   Yokokawa, S ^a   Ono, K ^a   Hirose, T ^a   Ohashi, Y ^a  

^a FUJITSU LABORATORIES LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BONDING; ELECTRIC PROPERTIES; GOLD; INTEGRATED CIRCUIT MANUFACTURE; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; RELIABILITY; SEMICONDUCTING GALLIUM ARSENIDE;

AUTOMOTIVE RADAR APPLICATIONS; FLIP CHIP BONDING TECHNOLOGY; GOLD MICROPILLARS;

FLIP CHIP DEVICES;

EID: 0030648268     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)