Advantages of flip chip technology in millimeter-wave packaging

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 1997, Pages 987-990

  Krems, T ^a   Haydl, W H ^a   Massler, H ^a   Ruediger, J ^a  

^a FRAUNHOFER INSTITUTE FOR APPLIED SOLID STATE PHYSICS IAF   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC LOSSES; FLIP CHIP DEVICES; MILLIMETER WAVE DEVICES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; NATURAL FREQUENCIES; SEMICONDUCTING GALLIUM ARSENIDE; SPECTRUM ANALYSIS; SURFACE MOUNT TECHNOLOGY; SURFACE WAVES; WAVEGUIDES;

POWER LEAKAGE;

ELECTRONICS PACKAGING;

EID: 0030715183     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)