Comparison of flip chip and wire bond interconnections and the technology evaluation on 51 GHz transceiver modules

1996 26th European Microwave Conference, EuMC 1996

Volumn 1, Issue , 1996, Pages 98-100

  Baumann, G ^a   Ferling, D ^b   Richter, H ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b Alcatel Telecom   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

LOW NOISE AMPLIFIERS; MICROSTRIP ANTENNAS; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; MOUNTINGS; TRANSCEIVERS;

BONDING PROCESS; DESIGN AND CONSTRUCTION; FLIP-CHIP MOUNTING; PLANAR PATCH ANTENNA; REPRODUCIBILITIES; SUBSTRATE BUMPING; TECHNOLOGY EVALUATION; TRANSCEIVER MODULES;

TECHNOLOGY;

EID: 1542385280     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMA.1996.337527     Document Type: Conference Paper

References (5)

1. D. Ferling, G. Baumann, "Flip Chip Mounted Amplifier on a Planar Antenna for Millimetrewave Transceiver Modules", Workshop on Low-Power Microwave Electronics, Oct. 1995, University of Ulm, Germany.
2. G. Baumann, et. al.: "SIGHz Frontend with Flip Chip and Wire Bond Interconnections from GaAs MMICs to a Planar Patch Antenna", 1995, Proc. IEEE MTT-S International Microwave Symposium, pp. 1639-1642.
3. H. Richter, A. Baumgartner, G. Baumann, D. Ferling "Flip Chip Attach of GaAs-Devices and Applications to Millimeter Wave Transmission Systems,"Proc. Microsystem Technologies '94 Conference, pp. 535-543, VDE-Verlag GmbH
4. D. Ferling, G. Baumann, H. Richter, A. Baumpartner, U. Meier: "Multichip Modules with Integrated Planar Antenna for mmWave Radio Communication". Proceedings 25th European Microwave Conference, p. 111-116, Bologna, Italy, Sept. 4-8, 1995.
5. A. Gemmler, W. Keller, H. Richter, K. Rueß: "High Performance Gold Plating for Micro Devices", 1994, Plating and Finishing, pp. 52-58.