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Volumn , Issue , 1997, Pages 885-889

Corrosion/migration study of flip chip underfill and ceramic overcoating

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; ALUMINA; CERAMIC COATINGS; CHROMIUM; CONDUCTIVE MATERIALS; COPPER; CORROSION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; MATHEMATICAL MODELS; MICROELECTRONICS; RELIABILITY;

EID: 0030687837     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (7)

References (6)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.