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Volumn , Issue , 1997, Pages 885-889
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Corrosion/migration study of flip chip underfill and ceramic overcoating
a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ACTIVATION ENERGY;
ALUMINA;
CERAMIC COATINGS;
CHROMIUM;
CONDUCTIVE MATERIALS;
COPPER;
CORROSION;
ELECTRONICS PACKAGING;
FAILURE ANALYSIS;
MATHEMATICAL MODELS;
MICROELECTRONICS;
RELIABILITY;
ARRHENIUS MODELS;
CERAMIC OVERCOATING;
FLIP CHIP UNDERFILL;
FLIP CHIP DEVICES;
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EID: 0030687837
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (7)
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References (6)
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