Effect of underfill epoxy on mechanical behavior of flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 1170-1175

  Zhang, Wenge ^a   Wu, Derick ^a   Su, Bingzhi ^a   Hareb, Saeed ^a   Lee, Y C ^a   Masterson, Pat ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CURING; ELECTRONICS PACKAGING; EPOXY RESINS; GLASS TRANSITION; MECHANICAL PROPERTIES; PLASTIC ADHESIVES; SOLDERED JOINTS; THERMAL EFFECTS;

UNDERFILL EPOXY; VON MISSES STRESS;

FLIP CHIP DEVICES;

EID: 0030708019     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)