Solder joint reliability modeling for a 540-I/O plastic ball-grid-Array assembly

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 422-428

  Su, B ^a   Hareb, S ^a   Lee, Y C ^a   Lii, M J ^b   Thurston, M E ^b  

^a UCB 450   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

fatigue; modeling; PBGA; reliability

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROPROCESSOR CHIPS; MODELS; MULTICHIP MODULES; RELIABILITY; SOLDERED JOINTS; THERMAL CYCLING;

BGA SOLDER JOINTS; PBGA; PLASTIC BALL GRID ARRAYS; SINGLE SOLDER JOINTS; SOLDER JOINT FATIGUE; SOLDER JOINT RELIABILITY; SUB-MODELING TECHNIQUE; THREE DIMENSIONAL FINITE ELEMENT MODEL;

BALL GRID ARRAYS;

EID: 33747266751     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670818     Document Type: Conference Paper

References (12)

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