Flip chip underfill reliability of CSP during IR reflow soldering

Annual Proceedings - Reliability Physics (Symposium)

Volumn , Issue , 1997, Pages 124-128

  Ohshima, Yumiko ^a   Nakazawa, Takahito ^a   Doi, Kazuhide ^a   Aoki, Hideo ^a   Hiruta, Yoichi ^a  

^a TOSHIBA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; DELAMINATION; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; INTERFACES (MATERIALS); RELIABILITY; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY;

CHIP SCALE PACKAGE (CSP); INFRARED REFLOW SOLDERING;

FLIP CHIP DEVICES;

EID: 0030647431     PISSN: 00999512     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)