Characterisation and Evaluation of the Underfill Encapsulants for Flip Chip Assembly

Circuit World

Volumn 21, Issue 3, 1995, Pages 25-32

  Wun, B ^a   Lau, J ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; CURING; ENCAPSULATION; EVALUATION; FLOW OF FLUIDS; OPTIMIZATION; PHYSICAL PROPERTIES; POLYMERS; SEMICONDUCTING SILICON; SOLDERING; SUBSTRATES; THERMOANALYSIS;

CHEMICAL PROPERTIES; FLIP CHIP ASSEMBLY; MECHANICAL ANALYSIS; ORGANIC SUBSTRATES; POLYMERIC UNDERFILL; SOLDER BUMPED FLIP CHIP DEVICES; TEST DIES;

FLIP CHIP DEVICES;

EID: 0029275313     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/eb044034     Document Type: Review

References (5)

1. Suryanarayana, D., Wu, T. Y. and Varcoe, J. A., ‘Encapsulants Used in Flip-Chip Packages’, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-16, No. 8, pp. 858–862 (1993).
2. Wang, D. W. and Papathomas, K. I., ‘Encapsulants for Fatigue Life Enhancement of Controlled Collapse Connection’, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. CHMT-16, No. 8, pp. 863–867 (1993).
3. Kelly, M. and Lau, J. H., ‘Low Cost Solder Bumped Flip Chip MCM-L Demonstration’, IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 147–153 (1994).
4. Clementi, J. and Hill, G., ‘Flip Chip Encapsulation of Small C4's on Fine Pitches’, Proceedings First International Symposium on Flip Chip Technology, San Jose, California, pp. 9–12 (1994).
5. ‘Chip on Board Technology for Multichip Modules’, edited by J. Lau, Van Nostrand Reinhold (1994).