MCM-C/D design for the CMOS implementation of the S/390 system

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1997, Pages 479-485

  Katopis, G ^a   Becker, D ^a   Smith, H ^a   Stoller, H ^a  

^a IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; CMOS INTEGRATED CIRCUITS; ELECTRONICS PACKAGING; SEMICONDUCTOR DEVICE MODELS; SUBSTRATES; THIN FILMS;

NOISE CONTAINMENT;

MULTICHIP MODULES;

EID: 0030705125     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)