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Volumn , Issue , 1996, Pages 144-148
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User's view of MCM-D/C packaging: is it worth the trouble?
a
a
IBM
(United States)
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Author keywords
[No Author keywords available]
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Indexed keywords
CERAMIC MATERIALS;
ELECTRIC WIRING;
MULTICHIP MODULES;
PERFORMANCE;
PRODUCT DESIGN;
SUBSTRATES;
THIN FILMS;
DESIGN METHODOLOGY;
NOISE ANALYSIS;
THIN FILM WIRING;
ELECTRONICS PACKAGING;
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EID: 0029708069
PISSN: 05695503
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Article |
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Times cited : (4)
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References (7)
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