Piezoresistive measurement and FEM analysis of mechanical stresses in 160L plastic quad flat packs

American Society of Mechanical Engineers, EEP

Volumn 19, Issue 2, 1997, Pages 1731-1740

  Sweet, James N ^a   Burchett, Steven N ^b   Peterson, David W ^a   Hsia, Alex H ^c   Chen, Andrea ^d  

^a Advanced Packaging Department 1333   (United States)

^b Eng and Mfg Mechanics Dept 9117

^c SANDIA NATIONAL LABORATORIES   (United States)

^d NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 5844370439     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (16)

1. Blanford, M. L. , 1996, "JAS3D - A Multi Strategy Iterative Code for Solid Mechanics Analysis - Release 1.4", Sandia internal memo to distribution, dtd 12/3/96.
2. th International Symposium on the Physical & Failure Analysis of Integrated Circuits, IEEE, pp. 96-101.
3. Guess, T. R., Burchett, S. N. "An Experimental/Analytical Study of Strains in Encapsulated Assemblies", 1993, J. Electronic Packaging, Vol. 115, pp. 298-304.
4. rd Electronic Components and Technology Conference, IEEE, 1993, pp. 264-269.
5. Mermet-Guyennet, M., 1993, "Thermal and Moisture Stresses in Plastic Packages", in J. H. Lau Editor, Thermal Stress and Strain in Microelectronics Packaging, Dover Publishing, NY, pp. 410-444.
6. Miura, H., Kitano, M., Nishimura, A., Kawai, S., 1993, "Thermal Stress Measurement in Silicon Chips Encapsulated in IC Plastic Packages Under Temperature Cycling", J. Electronic Packaging, Vol. 115, pp. 9-15.
7. Miura, H., Kumazamw, T., Nishimura, A., ""Effect of Delamination at Chip/Encapsulant Interface on Chip Stress and Transistor Characteristics", (1995), Proc. 1995 ASME Int. Mech. Engr. Congress, Applications of Experimental Mechanics to Electronic Packaging, Vol. EPP-13, pp. 73-77.
8. th Electronic Components and Tech. Conference, IEEE, pp. 1239-1243.
9. Nguyen, L. T. and Chen, K. L. 1993, "Molding Compound Trends in a Denser Packaging World: Part III - Property Optimization for Minimum Stress", ASME Proceedings-Vol. 6, Electronic Packaging Reliability, ASME, pp. 101-114.
10. Nguyen, L. T., 1993, "Reliability of Postmolded IC Packages", ASME Journal of Electronic Packaging, Vol. 115, pp. 346-355.
11. Nguyen, L. T., Gee, S. A., Johnson, M. R., Grimm, H. E., Berardi, H., and Walberg R. L., (1995), "Effects of Die Coatings, Mold Compounds, and Test Conditions on Temperature Cycling Failures", IEEE Trans. Components, Packaging, and Manufacturing Technology, Part A Vol. 18, pp. 15-22.
12. Skipor, A. F., Baird, J., Jeffery, D., Ommen, D., Westlake, M., 1995, "Experimental Validation and Finite Element Simulation of a 64L TQFP and a 68L PLCC", Proc. 1995 ASME Int. Mech. Engr. Congress, Sensors in Electronic Packaging, Vol. EPP-14, pp. 1-9.
13. Sweet, J. N., 1993, "Die Stress Measurement Using Piezoresistive Stress Sensors", in J. H. Lau Editor, Thermal Stress and Strain in Microelectronics Packaging, Van Nostrand Reinhold, NY, 1993, pp. 221-271.
14. Sweet, J. N., Peterson, D. W. and Emerson, J. A., 1994 "Liquid Encapsulant and Uniaxial Calibration Mechanical Stress Measurement with the ATC04 Assembly Test Chip", Proc. 44th Electronic Components and Technology Conference, IEEE, pp. 750-757.
15. Sweet, J. N., Peterson, D. W. Emerson, J. A. and Burchett, S. N., 1995, "Experimental Measurements and Finite Element Calculations for Liquid Encapsulated ATC04 Assembly Test Chips, Proc. 1995 ASME Int. Mech. Engr. Congress, Applications of Experimental Mechanics to Electronic Packaging, Vol. EPP-13, pp. 61-71.
16. Sweet, J. N., Peterson, D. W. Emerson, J. A. and Mitchell, R. T., 1995, "Liquid Encapsulant Stress Variations as Measured with the ATC04 Assembly Test Chip, Proc. 45th Electronic Components and Technology Conference, IEEE, pp. 300-307.