Micro-machined heat pipes in silicon MCM substrates

Proceedings of the IEEE Multi-Chip Module Conference

Volumn , Issue , 1996, Pages 127-129

  Benson, D A ^a   Mitchell, R T ^a   Tuck, M R ^a   Adkins, D R ^a   Palmer, D W ^a  

^a Natl Lab   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; CERAMIC MATERIALS; COOLING; HEAT PIPES; HEAT SINKS; HEAT TRANSFER; SILICON WAFERS; SUBSTRATES; THERMAL CONDUCTIVITY; THERMAL EXPANSION;

ALUMINUM NITRIDE CERAMIC; HEAT SPREADING CAPABILITY; HERMETIC MICRO-CAVITIES; MICROMACHINED CAPILLARY WICK STRUCTURES; POWER DENSITIES;

MULTICHIP MODULES;

EID: 0029755303     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)