Moiré Interferometer, an Effective Tool in Electronic Packaging, Concept and Applications

International Journal of Microcircuits and Electronic Packaging

Volumn 22, Issue 3, 1999, Pages 212-219

  Zou, Daqing ^a   Lu, Minfu ^a   Shi, Ling ^a,c,d,e   Wang, Jianjun ^a,f   Liu, Sheng ^a   Guo, Yifan ^b  

^a Wayne State University   (United States)

^b MOTOROLA INC   (United States)

^c TSINGHUA UNIVERSITY   (China)

^d BAM FEDERAL INSTITUTE FOR MATERIALS RESEARCH AND TESTING   (Germany)

^e University of Illinois at Urbana Champaign   (United States)

^f WAYNE STATE UNIVERSITY   (United States)

Author keywords

Coefficient of Thermal Expansion; Finite Element Method; Moir Interferometer; Shear Strain

Indexed keywords

EID: 0005479246     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (16)

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